A W-Band Wideband Via-Holes Transition Design Based on Multilayer LCP Substrate
Author:
Affiliation:
1. School of Electronic Engineering, Xi'an University of Posts & Telecommunications,Xi'an,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10380804/10380975/10381302.pdf?arnumber=10381302
Reference9 articles.
1. 5G wireless communication systems: prospects and challenges [Guest Editorial]
2. System-in-package integrated antennas in industrial and prospective packages for MMW applications
3. An Overview of the Development of Antenna-in-Package Technology for Highly Integrated Wireless Devices
4. Development of millimeter-wave devices based on liquid crystal polymer (LCP) substrate
5. LCP Ultra-Wideband Self-Packaged Microstrip to Stripline Transition with Multilayer Balun Demonstration
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