A novel concept for MM-wave MMIC interconnects and packaging-Reference-Cited by-同舟云学术

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A novel concept for MM-wave MMIC interconnects and packaging

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Container-title:1994 IEEE MTT-S International Microwave Symposium Digest (Cat. No.94CH3389-4)
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Author:

Strauss G.,Menzel W.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/1100/7886/00335545.pdf?arnumber=335545

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Bonding Wire Interconnects between MMIC for 5-GHz Intra/Inter-Chip Communications;2022 19th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON);2022-05-24

2. Broadband planar integration and packaging for millimeter-wave circuit design at the V-band;Microwave and Optical Technology Letters;2005

3. Modeling and characterization of the bonding-wire interconnection;IEEE Transactions on Microwave Theory and Techniques;2001

4. Full-wave analysis of asymmetric CPW-microstrip overlap transitions for MMIC interconnects and packaging;Microwave and Optical Technology Letters;1997-12-20

5. Millimeter-wave monolithic integrated circuit interconnects using electromagnetic field coupling;IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B;1996-05

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