Study on the Manufacturing Process of Multilayer Silicon-based Filters Based on Au-Sn Soldering-Reference-Cited by-同舟云学术

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Study on the Manufacturing Process of Multilayer Silicon-based Filters Based on Au-Sn Soldering

Published:2023-07-15 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM)
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Author:

Gong Yaolong¹,Yang Shicheng¹,Li Sheng²,Wang Feng¹,Xia Weijuan¹,Wang Ping¹

Affiliation:

1. China Aerospace Science and Technology, (CAST504),Dept. of Microwave and Millimeter Wave Circuits,Xi’an,China

2. China Aerospace Science and Technology (CAST504),Dept. of Nation Key Laboratory of Science and Technology on Space Microwave,Xi’an,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10234726/10234830/10234948.pdf?arnumber=10234948

Reference9 articles.

1. A Silicon-Micromachined Waveguide Platform With Axial Ports for Integrated Sub-THz Filters

2. Development of advanced AuSn alloy plating technology for semiconductor application

3. Wafer-level AuSn and CuSn bonding for MEMS encapsulation;suni;2013 Eurpoean Microelectronics Packaging Conference (EMPC) EMPC,2013

4. A 23–35 GHz MEMS tunable all-silicon cavity filter with stability characterization up to 140 million cycles;an;Microwave Symposium IEEE,2014

5. Design of microwave filter based on TSV;wang;Xidian Uniwersity,2020

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