Yield prediction in semiconductor manufacturing using an AI-based cascading classification system

Author:

Stich Peter,Wahl Michael,Czerner Peter,Weber Christian,Fathi Madjid

Publisher

IEEE

Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Pioneering Excellence in Semiconductor Manufacturing via XGBoost with BAT Optimization for Cutting-Edge Predictive Maintenance;2024 IEEE International Conference on Big Data & Machine Learning (ICBDML);2024-02-24

2. Using the Test Guardband Estimation Method to Forecast Future Semiconductor Yield Trends;IETE Journal of Research;2024-02

3. Industry 5.0: Research Areas and Challenges With Artificial Intelligence and Human Acceptance;IEEE Industrial Electronics Magazine;2024

4. Wafer yield prediction using AI: potentials and pitfalls;Metrology, Inspection, and Process Control XXXVII;2023-04-27

5. Data Additive Residual Learning based Yield Prediction for Semiconductor Manufacturing;2023 IEEE 39th International Conference on Data Engineering (ICDE);2023-04

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