A 42.24 Gb/s Channel Bonding Up-Converter with integrated multi-LO generation in 45nm CMOS-Reference-Cited by-同舟云学术

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A 42.24 Gb/s Channel Bonding Up-Converter with integrated multi-LO generation in 45nm CMOS

Published:2023-01-22 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 23rd Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems
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Author:

Siligaris A.¹,Courouve P.¹,Waltener G.¹,Hamani A.¹,Dehos C.¹,Gonzalez-Jimenez J. L.¹

Affiliation:

1. Université Grenoble-Alpes,CEA,Leti,Grenoble,France

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10046197/10046144/10046233.pdf?arnumber=10046233

Reference9 articles.

1. A Multichannel Programmable High Order Frequency Multiplier for Channel Bonding and Full Duplex Transceivers at 60 GHz Band

2. A 250-mW 60-GHz CMOS Transceiver SoC Integrated With a Four-Element AiP Providing Broad Angular Link Coverage

3. Analysis and Design of Cost-Effective, High-Throughput LDPC Decoders

4. 13.6 A 42Gb/s 60GHz CMOS transceiver for IEEE 802.11ay

5. 20.3 A 64-QAM 60GHz CMOS transceiver with 4-channel bonding

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