Buried PN Junctions Impact on the Performances of an Inductor at RF Frequencies
Author:
Affiliation:
1. Université Grenoble Alpes,CEA – LETI,Grenoble,France
2. Université Catholique de Louvain,ICTEAM,Louvain-la-Neuve,Belgium
3. SOITEC,Bernin,France
Funder
European Commission
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10046197/10046144/10046229.pdf?arnumber=10046229
Reference7 articles.
1. Physical Models of Planar Spiral Inductor Integrated on the High-Resistivity and Trap-Rich Silicon-on-Insulator Substrates
2. High-resistivity silicon-based substrate using buried PN junctions towards RFSOI applications
3. Silicon-substrate enhancement technique enabling high quality integrated RF passives
4. A physical model for planar spiral inductors on silicon
5. Engineering SOI substrates for RF to mmWave frontends;allibert;Microwave Journal,2020
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