A Neural Network Approach for Single-Event Latchup Prediction Based on TCAD Simulations in CMOS Technology
Author:
Affiliation:
1. Microchip Technology,Nantes,France,44300
2. Microchip Technology,13106
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9954459/9954461/09954493.pdf?arnumber=9954493
Reference15 articles.
1. The effect of temperature on single-particle latchup
2. Single Event Latch-Up Hardening Using TCAD Simulations in 130 nm and 65 nm Embedded SRAM in Flash-Based FPGAs
3. Selection of Well Contact Densities for Latchup-Immune Minimal-Area ICs
4. Fundamentals of Ocean Renewable Energy;neill,0
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