Thermal Aware System-Wide Reliability Optimization for Automotive Distributed Computing Applications-Reference-Cited by-同舟云学术

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Thermal Aware System-Wide Reliability Optimization for Automotive Distributed Computing Applications

Published:2022-10 Issue:10 Volume:71 Page:10442-10457
ISSN:0018-9545
Container-title:IEEE Transactions on Vehicular Technology
language:
Short-container-title:IEEE Trans. Veh. Technol.

Author:

Bankar Ajinkya S.¹^ORCID,Sha Shi²^ORCID,Bhimani Janki³^ORCID,Chaturvedi Vivek⁴^ORCID,Quan Gang¹^ORCID

Affiliation:

1. Department of Electrical and Computer Engineering, Florida International University, Miami, FL, USA

2. College of Business and Engineering, Wilkes University, Wilkes-Barre, PA, USA

3. Knight Foundation School of Computing and Information Sciences, Florida International University, Miami, FL, USA

4. Department of Computer Science And Engineering, Indian Institute of Technology, Palakkad, Kerala, India

Funder

Dissertation Year Fellowship of the University Graduate School

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Networks and Communications,Aerospace Engineering,Automotive Engineering

Link

http://xplorestaging.ieee.org/ielx7/25/9920678/09806371.pdf?arnumber=9806371

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Lifetime Reliability Aware Distributed Estimation and Communication Co-Design for IIoT Systems;IEEE Transactions on Industrial Informatics;2024

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