Trade-off Between Thermal Budget and Thickness Scaling: A Bottleneck on Quest for BEOL Compatible Ultra-Thin Ferroelectric Films Sub-5nm
Author:
Affiliation:
1. National Yang Ming Chiao Tung University,Institute of Electronics,Hsinchu,Taiwan
Funder
National Science and Technology Council
Industrial Technology Research Institute
Taiwan Semiconductor Manufacturing Company
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10511270/10511310/10511710.pdf?arnumber=10511710
Reference20 articles.
1. Multicore Spiking Neuromorphic Chip in 180-nm With ReRAM Synapses and Digital Neurons
2. An INT8 Charge-Digital Hybrid Compute-In-Memory Macro with CNN-Friendly Shift-Feed Register Design
3. 24.5 A Twin-8T SRAM Computation-In-Memory Macro for Multiple-Bit CNN-Based Machine Learning
4. 15.3 A 65nm 3T Dynamic Analog RAM-Based Computing-in-Memory Macro and CNN Accelerator with Retention Enhancement, Adaptive Analog Sparsity and 44TOPS/W System Energy Efficiency
5. A compute-in-memory chip based on resistive random-access memory
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