Recurrent Neural Network (RNN) Based Signal Integrity Assessment for Coaxial-Through Glass Vias in Three-Dimensional Integration
Author:
Affiliation:
1. National Institute of Technology Hamirpur (HP),India
Funder
Science and Engineering Research Board
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10511270/10511310/10511362.pdf?arnumber=10511362
Reference10 articles.
1. Modeling of Carbon Nanotube-Based Differential Through-Silicon Vias in 3-D ICs
2. Modeling and Analysis of Cu-CNT Composite Through Glass Vias in 3D ICs
3. Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs
4. Incorporation of terminal constraints in the FDTD analysis of transmission lines
5. Wideband Impedance Model for Coaxial Through-Silicon Vias in 3-D Integration
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