Electrical Analysis for Wafer-Bonded Interfaces of p+GaAs/n+InGaAs and p+InGaAs/n+InGaAs
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Published:2021-06
Issue:6
Volume:42
Page:800-803
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ISSN:0741-3106
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Container-title:IEEE Electron Device Letters
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language:
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Short-container-title:IEEE Electron Device Lett.
Author:
Geum Dae-MyeongORCID,
Kim Seong Kwang,
Lim Hyeong-Rak,
Park Juhyuk,
Jeong Jaeyong,
Han Jae Hoon,
Choi Won Jun,
Kim Hyo-Jin,
Kim SanghyeonORCID
Funder
National Research Foundation of Korea
System Semiconductor Development Program funded by Gyeonggi-do
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials