Author:
Hess Christopher,Saxena Sharad,Karbasi Hossein,Subramanian Senthil,Quarantelli Michele,Rossoni Angelo,Tonello Stefano,Zhao Sa,Slisher Dustin
Cited by
7 articles.
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1. Design of Low-Cost Test Structures for Measuring Within-Die Process Skew Variations;2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS);2022-03-21
2. Characterization Challenges and Solutions for FDSOI Technologies;2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S);2019-10-14
3. Reversible Scan Based Diagnostic Patterns;2019 International Symposium on VLSI Design, Automation and Test (VLSI-DAT);2019-04
4. Contact Chains for FinFET Technology Characterization;IEEE Transactions on Semiconductor Manufacturing;2015-08
5. Addressable Arrays Implemented with One Metal Level for MOSFET and Resistor Variability Characterization;2009 IEEE International Conference on Microelectronic Test Structures;2009-03