High-Attenuation Backing Layer for Miniaturized Ultrasound Imaging Transducer-Reference-Cited by-同舟云学术

High-Attenuation Backing Layer for Miniaturized Ultrasound Imaging Transducer

Published:2022-06 Issue:6 Volume:69 Page:1960-1969
ISSN:0885-3010
Container-title:IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
language:
Short-container-title:IEEE Trans. Ultrason., Ferroelect., Freq. Contr.

Author:

Kim Heesoo¹^ORCID,Yoo Jinhee²^ORCID,Heo Dasom³,Seo Young-Seok⁴^ORCID,Lim Hae Gyun⁵^ORCID,Kim Hyung Ham⁶^ORCID

Affiliation:

1. Department of Convergence IT Engineering and the Future IT Innovation Laboratory, Pohang University of Science and Technology (POSTECH), Pohang, Republic of Korea

2. School of Interdisciplinary Bioscience and Bioengineering, Pohang University of Science and Technology (POSTECH), Pohang, Republic of Korea

3. Department of Mechanical Engineering, Pohang University of Science and Technology (POSTECH), Pohang, Republic of Korea

4. Research and Development Center, Won Tech Company Ltd., Daejeon, Republic of Korea

5. Department of Biomedical Engineering, Pukyong National University, Busan, Republic of Korea

6. Department of Electrical Engineering, Department of Convergence IT Engineering and Medical Device Innovation Center, Pohang University of Science and Technology (POSTECH), Pohang, Republic of Korea

Funder

Industrial Strategic Technology Development Program

Ministry of Trade, Industry and Energy (MOTIE), South Korea

Korea Medical Device Development Fund funded by the Korea Government

Basic Science Research Program through the National Research Foundation of Korea

Ministry of Education

Brain Korea 21 (BK21) FOUR Project

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Acoustics and Ultrasonics,Instrumentation

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