Imprinted laminate wafer-level packaging for SAW ID-tags and SAW delay line sensors-Reference-Cited by-同舟云学术

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Imprinted laminate wafer-level packaging for SAW ID-tags and SAW delay line sensors

Published:2011-02 Issue:2 Volume:58 Page:406-413
ISSN:0885-3010
Container-title:IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control
language:
Short-container-title:IEEE Trans. Ultrason., Ferroelect., Freq. Contr.

Author:

Kuypers J H,Tanaka S,Esashi M

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Acoustics and Ultrasonics,Instrumentation

Link

http://xplorestaging.ieee.org/ielx5/58/5716437/05716458.pdf?arnumber=5716458

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Development of 3-D Wafer Level Packaging for SAW Filters Using Thin Glass Capping Technology;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-02

2. Copper Pillar Bumps on Acoustic Wave Components;2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC);2019-09

3. A Bright Outlook for Acoustic Filtering: A New Generation of Very Low-Profile SAW, TC SAW, and BAW Devices for Module Integration;IEEE Microwave Magazine;2015-08

4. Analysis of passive surface acoustic wave sensors using coupling of modes theory;Japanese Journal of Applied Physics;2014-06-04

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