Thermal Control Design and Packaging for Surface Acoustic Wave Devices in Acoustofluidics-Reference-Cited by-同舟云学术

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Thermal Control Design and Packaging for Surface Acoustic Wave Devices in Acoustofluidics

Published:2022-01 Issue:1 Volume:69 Page:386-398
ISSN:0885-3010
Container-title:IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
language:
Short-container-title:IEEE Trans. Ultrason., Ferroelect., Freq. Contr.

Author:

Han Junlong^ORCID,Yang Fan,Hu Hong^ORCID,Huang Qingyun,Lei Yulin,Li MingYu

Funder

Shenzhen Government Fund

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Acoustics and Ultrasonics,Instrumentation

Link

http://xplorestaging.ieee.org/ielx7/58/9667232/09502138.pdf?arnumber=9502138

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal Stress Analysis and Control Method for Surface Acoustic Wave Atomizer;Sensors;2023-10-26

2. A full-field warpage characterization measurement method coupled with infrared information;Microelectronics Reliability;2023-10

3. Separation of Heating and Magnetoelastic Coupling Effects in Surface-Acoustic-Wave-Enhanced Creep of Magnetic Domain Walls;Physical Review Applied;2023-07-05

4. Combination of pulse signal modulation and hydrophilic treatment of a substrate for controlling the thermal distribution in surface acoustic wave atomization;Applied Thermal Engineering;2023-06

5. High throughput particle sorting based on traveling surface acoustic wave (TSAW) is realized by coupling spiral microchannel and a novel arc electrode;Physica Scripta;2023-02-28

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