Low-Temperature Solution Approaches for the Potential Integration of Ferroelectric Oxide Films in Flexible Electronics-Reference-Cited by-同舟云学术

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Low-Temperature Solution Approaches for the Potential Integration of Ferroelectric Oxide Films in Flexible Electronics

Published:2020-10 Issue:10 Volume:67 Page:1967-1979
ISSN:0885-3010
Container-title:IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
language:
Short-container-title:IEEE Trans. Ultrason., Ferroelect., Freq. Contr.

Author:

Bretos Inigo,Jimenez Ricardo,Ricote Jesus^ORCID,Calzada M. Lourdes^ORCID

Funder

Ministry of Science and Innovation through the Spanish Projects

Spanish “Ramón y Cajal” Programme

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Acoustics and Ultrasonics,Instrumentation

Link

http://xplorestaging.ieee.org/ielx7/58/9205930/09094729.pdf?arnumber=9094729

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1. Spin-coated BiFeO3 films on Si wafers: Low processing temperature but prominent piezoelectricity;Journal of Materiomics;2024-08

2. Bulk-like ferroelectricity and magnetoelectric response of low-temperature solution-processed BiFeO3–PbTiO3 films on Ni for metallic MEMS;APL Energy;2023-11-21

3. Multi‐Functional Atomically Thin Oxides from Bismuth Liquid Metal;Advanced Functional Materials;2023-09-19

4. Low-temperature sol–gel methods for the integration of crystalline metal oxide thin films in flexible electronics;Journal of Sol-Gel Science and Technology;2023-03-03

5. In situphotogenerated hydroxyl radicals in the reaction atmosphere for the accelerated crystallization of solution-processed functional metal oxide thin films;Journal of Materials Chemistry C;2023

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