Equipment Condition Diagnosis and Fault Fingerprint Extraction in Semiconductor Manufacturing
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7835817/7838104/07838198.pdf?arnumber=7838198
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Leveraging Machine Learning for Capacity and Cost on a Complex Toolset: A Case Study;IEEE Transactions on Semiconductor Manufacturing;2023-11
2. Equipment Sensor Data Cleansing Algorithm Design for ML-Based Anomaly Detection;2022 International Symposium on Semiconductor Manufacturing (ISSM);2022-12-12
3. Machine learning and data mining in manufacturing;Expert Systems with Applications;2021-03
4. An overlap-sensitive margin classifier for imbalanced and overlapping data;Expert Systems with Applications;2018-05
5. Anomaly Detection Approaches for Semiconductor Manufacturing;Procedia Manufacturing;2017
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