Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Cited by
3 articles.
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1. Study of harmonic control power amplifier technology based on improved modeling of bondwire;International Journal of RF and Microwave Computer-Aided Engineering;2022-07-25
2. Bondwire Model and Compensation Network for 60 GHz Chip-to-PCB Interconnects;IEEE Antennas and Wireless Propagation Letters;2021-11
3. Packaging Technologies;Antenna‐in‐Package Technology and Applications;2020-03-06