EPA ECC: Error-Pattern-Aligned ECC for HBM2E-Reference-Cited by-同舟云学术

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EPA ECC: Error-Pattern-Aligned ECC for HBM2E

Published:2023-06-25 Issue: Volume: Page:
ISSN:
Container-title:2023 International Technical Conference on Circuits/Systems, Computers, and Communications (ITC-CSCC)
language:
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Author:

Kwon Kiheon¹,Kim Dongwhee²,Park Soyoung³,Kim Jungrae⁴

Affiliation:

1. Sungkyunkwan University,Dept. of Electrical and Computer Engineering,Suwon,Republic of Korea

2. Sungkyunkwan University,Dept. of Semiconductor and Display Engineering,Suwon,Republic of Korea

3. Sungkyunkwan University,Dept. of Artificial Intelligence,Suwon,Republic of Korea

4. Sungkyunkwan University,Dept. of Semiconductor Systems Engineering,Suwon,Republic of Korea

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10211092/10212431/10212882.pdf?arnumber=10212882

Reference14 articles.

1. Rodinia: A benchmark suite for heterogeneous computing

2. Accel-Sim: An Extensible Simulation Framework for Validated GPU Modeling

3. Architecting an Energy-Efficient DRAM System for GPUs

4. 22.1 a 1.1 v 16gb 640gb/s hbm2e dram with a data-bus window-extension technique and a synergetic on-die ecc scheme;oh;2020 ISSCC,0

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