Metal Migration (Ag, Cu, Pb) in Encapsulated Modules and Time-to-Fail Model as a Function of the Environment and Package Properties-Reference-Cited by-同舟云学术

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Metal Migration (Ag, Cu, Pb) in Encapsulated Modules and Time-to-Fail Model as a Function of the Environment and Package Properties

Published:1982-03 Issue: Volume: Page:
ISSN:0735-0791
Container-title:20th International Reliability Physics Symposium
language:
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Author:

DiGiacomo Giulio

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4208411/4208412/04208420.pdf?arnumber=4208420

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Combined Effects of Polluted Particles and Environmental Factors on Electrochemical Migration Failure;IEEE Transactions on Device and Materials Reliability;2023-03

3. Basic theory of corrosion and important failure mechanisms connected to corrosion in electronics;Humidity and Electronics;2022

4. Design for Reliability;Design for Excellence in Electronics Manufacturing;2021-03-19

5. Failure analysis on reflector blackening between lead frame electrodes in LEDs under WHTOL test;Microelectronics Reliability;2015-04

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