Robust Wireless Interrogation of Fully-Passive RLC Sensors
Author:
Affiliation:
1. Department of Electrical Engineering, Stanford University, Stanford, CA, USA
Funder
Qualcomm Innovation Fellowship
Chan Zuckerberg Biohub
Stanford Bio-X IIP Seed Grant
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/8919/9745276/09678949.pdf?arnumber=9678949
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1. High-Efficiency Wireless Power Transfer for Biomedical Implants by Optimal Resonant Load Transformation
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5. Electronic technique and circuit topology for accurate distance-independent contactless readout of passive LC sensors
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