Affiliation:
1. School of Integrated Circuits, Tsinghua University, Haidian, Beijing, China
Funder
National Key Research and Development Program of China
Beijing Microelectronics Technology Institute (BMTI) Tongxin Program Fund
Natural Science Foundation of China
Shanghai Municipal Science and Technology Major Project
Beijing Superstring Academic Institution
Beijing Advanced Innovation Center for Integrated Circuits
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Hardware and Architecture