A High-Performance, Low Power Research Hearing Aid featuring a High-Level Programmable Custom 22nm FDSOI SoC<sup>*</sup>-Reference-Cited by-同舟云学术

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A High-Performance, Low Power Research Hearing Aid featuring a High-Level Programmable Custom 22nm FDSOI SoC^*

Published:2023-07-24 Issue: Volume: Page:
ISSN:
Container-title:2023 45th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC)
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Author:

Karrenbauer Jens¹,Schönewald Sven¹,Klein Simon¹,Blawat Meinolf²,Benndorf Jens²,Blume Holger¹

Affiliation:

1. Leibniz University Hannover,Institute of Microelectronic Systems (IMS),Hannover,Germany,30167

2. Dream Chip Technologies GmbH,Garbsen,Germany,30827

Funder

Ministry of Education

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10339936/10339939/10340206.pdf?arnumber=10340206

Reference16 articles.

1. Deafness and hearing loss;Fact Sheet,2021

2. Binaural Speaker Localization Integrated Into an Adaptive Beamformer for Hearing Aids

3. A Regression Approach to Speech Enhancement Based on Deep Neural Networks

4. Bimodal Cochlear Implant Processing based on Assisted Hearing algorithms with CCi-MOBILE: an open-source research platform

5. A high-fidelity multi-channel portable platform for development of novel algorithms for assistive listening wearables

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Enhancing a Hearing Aid Processor with ISA Extensions Supporting Flexible Fixed-Point Formats;2024 IEEE 35th International Conference on Application-specific Systems, Architectures and Processors (ASAP);2024-07-24

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