Analytical Time-Domain Models for the Analysis of Tapered Differential Multibit TGVs for 3D ICs
Author:
Affiliation:
1. National Institute of Technology,Electronics and Communication Engineering Department,Hamirpur,India
Funder
Science and Engineering Research Board
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10467193/10468066/10468479.pdf?arnumber=10468479
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4. NXP system-in-package vision and latest 3D technology developments;Yannou;Adv. Microelectron.,2007
5. Through-package-via formation and metallization of glass interposers
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