Design of a Frequency Conversion TR Module with Silicon-Based Packaging-Reference-Cited by-同舟云学术

Design of a Frequency Conversion TR Module with Silicon-Based Packaging

Published:2022-12-17 Issue: Volume: Page:
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Container-title:2022 Cross Strait Radio Science & Wireless Technology Conference (CSRSWTC)
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Author:

Wang Rui¹,Jiao Zonglei²,Wu Wei¹

Affiliation:

1. The 38th Research Institute of China Electronics Technology Group Corporation,Hefei,China,230088

2. Nanjing Electronic Devices Institute,Nanjing,China,210016

Publisher

IEEE

Link

Reference6 articles.

1. New Progress of the Micro System Three-Dimensional Integration Technology[J];zhengping;Micronanoelectronic Technology,2017

2. Integrated microsystems: a revolution on five frontiers[C];zolper;Proceedings of 24th DARPA-Tech Conference,2005

3. Silicon Based RF Microsystem Using 3D Heterogeneous Intergration Technology;yuanwei;Research & Progress of Solid State Electronics,2019

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