Author:
Dong Hui ,Zhu Yisheng ,Zhao Baishan
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Evaluating 224G SI Performance of Vertical Interconnections on Package Substrate and PCB;2024 Conference of Science and Technology for Integrated Circuits (CSTIC);2024-03-17
2. Analysis and Modeling of the Near Magnetic Field Distribution of Toroidal Inductors;2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI);2023-07-29
3. Design and Analysis of Low Frequency Passive Scattering Echo Intensifier;2023 8th International Conference on Computer and Communication Systems (ICCCS);2023-04-21