1. Life assessment of Micro-via used in thin Printed Circuit Board under Thermal Cycling loads & influence of selected design parameters;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
2. Flexible and Wearable EBG loaded SIW Band Pass Filter (BPF);2023 14th International Conference on Computing Communication and Networking Technologies (ICCCNT);2023-07-06
3. The Art of Substrate-Integrated-Waveguide Power Dividers;IEEE Access;2023
4. An Insight to Textile Substrates for Wearable Antenna;Micro-Electronics and Telecommunication Engineering;2023
5. Substrate Integrated Waveguide Antenna with Slow Wave Effect to Minimize Dimensions;2022 IEEE 9th Uttar Pradesh Section International Conference on Electrical, Electronics and Computer Engineering (UPCON);2022-12-02