Author:
Schlag Leslie,Grau Richard,Hossain Mobassar,Nahrstedt Helene,Isaac Nishchay Angel,Reiprich Johannes,Pezoldt Jorg,Jacobs Heiko Otto
Cited by
2 articles.
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1. Materials Quest for Advanced Interconnect Metallization in Integrated Circuits;Advanced Science;2023-06-15
2. Ruthenium and Rhodium Vertical Interconnect Formation Using Gas Phase Electrodeposition;2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM);2023-05