Thermal-Aware Task Scheduling for 3D Multicore Processors

Author:

Zhou Xiuyi,Yang Jun,Xu Yi,Zhang Youtao,Zhao Jianhua

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Computational Theory and Mathematics,Hardware and Architecture,Signal Processing

Cited by 60 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. NeuroTAP: Thermal and Memory Access Pattern-Aware Data Mapping on 3D DRAM for Maximizing DNN Performance;ACM Transactions on Embedded Computing Systems;2024-09-11

2. 3D-TemPo: Optimizing 3-D DRAM Performance Under Temperature and Power Constraints;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2024-08

3. TREAFET: Temperature-Aware Real-Time Task Scheduling for FinFET based Multicores;ACM Transactions on Embedded Computing Systems;2024-06-29

4. A survey on mapping and scheduling techniques for 3D Network-on-chip;Journal of Systems Architecture;2024-02

5. Thermal Management for 3D-Stacked Systems via Unified Core-Memory Power Regulation;ACM Transactions on Embedded Computing Systems;2023-09-09

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