Two-Phase Thermosiphon Cooling Using Integrated Heat Spreaders With Copper Microstructures-Reference-Cited by-同舟云学术

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Two-Phase Thermosiphon Cooling Using Integrated Heat Spreaders With Copper Microstructures

Published:2018-05 Issue: Volume: Page:
ISSN:
Container-title:2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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Author:

Abreu Vasco,Harrison Matthew,Gess Joshua,Moita Ana S.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8408415/8419442/08419644.pdf?arnumber=8419644

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Visualization of Boiling Heat Transfer on Copper Surface with Different Wettability;Journal of Thermal Science;2022-03-29

2. Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics;Journal of Electronic Packaging;2021-08-27

3. Nanofluids for the Next Generation Thermal Management of Electronics: A Review;Symmetry;2021-07-27

4. A new pool boiling heat transfer correlation for wetting dielectric fluids on metal foams;International Journal of Heat and Mass Transfer;2021-06

5. Boiling heat transfer and bubble distribution on inhomogeneous wetting surface patterned with Sierpinski carpet;Applied Thermal Engineering;2020-11

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