Thermal and mechanical analysis and design of the IBM Power 775 water cooled supercomputing central electronics complex-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Thermal and mechanical analysis and design of the IBM Power 775 water cooled supercomputing central electronics complex

Published:2012-05 Issue: Volume: Page:
ISSN:
Container-title:13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
language:
Short-container-title:

Author:

Goth Gary F.,Arvelo Amilcar,Eagle Jason,Ellsworth Michael J.,Marston Kenneth C.,Sinha Arvind K.,Zitz Jeffrey A.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6222648/6231398/06231496.pdf?arnumber=6231496

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The Performance and Characteristics of the Cooling System of Processors in Data Centres;Cooling Technologies - Technologies and Systems to Guarantee Thermal Comfort in Efficient Buildings;2023-03-27

2. Simulation study on cooling effect of two-phase liquid-immersion cabinet in data center;Applied Thermal Engineering;2022-05

3. Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers;Journal of Electronic Packaging;2021-11-22

4. Thermal Reliability and Electrical Properties of Integrated Copper Inverse Opal Structures;Advanced Engineering Materials;2021-08-20

5. Embedded Cooling for Wide Bandgap Power Amplifiers: A Review;Journal of Electronic Packaging;2019-07-30

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP