Solder-bonded carbon nanotube thermal interface materials-Reference-Cited by-同舟云学术

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Solder-bonded carbon nanotube thermal interface materials

Published:2012-05 Issue: Volume: Page:
ISSN:
Container-title:13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
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Author:

Barako Michael T.,Gao Yuan,Marconnet Amy M.,Asheghi Mehdi,Goodson Kenneth E.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6222648/6231398/06231562.pdf?arnumber=6231562

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Enhancing interfacial thermal conductivity of copper-carbon nanotube array composite via metallic bonding: Molecular dynamics simulations;Chemical Physics;2024-08

2. Encapsulated carbon nanotube array as a thermal interface material compatible with standard electronics packaging;Nano Research;2023-07-17

3. Highly-conductive, durability and flexible graphene-metal brazed strip and its heat-dissipation performance;Ceramics International;2023-06

4. Ultrasonic-assisted soldering for graphite films as heat sinks with durably superior heat dissipating efficiency;Advanced Composites and Hybrid Materials;2021-04-22

5. Nucleate pool boiling heat transfer enhancement in saturated Novec 7100 using titanium dioxide nanotube arrays;International Communications in Heat and Mass Transfer;2021-03

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