High heat flux two-phase cooling of electronics with integrated diamond/porous copper heat sinks and microfluidic coolant supply-Reference-Cited by-同舟云学术

High heat flux two-phase cooling of electronics with integrated diamond/porous copper heat sinks and microfluidic coolant supply

Published:2016-05 Issue: Volume: Page:
ISSN:
Container-title:2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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Author:

Palko James W.,Hyoungsoon Lee ,Agonafer Damena D.,Zhang Chi,Ki Wook Jung ,Moss Jess,Wilbur Joshua D.,Dusseault Tom J.,Barako Michael T.,Houshmand Farzad,Rong Guoguang,Maitra Tanmoy,Gorle Catherine,Won Yoonjin,Rockosi Derrick,Mykyta Ihor,Resler Dan,Altman David,Asheghi Mehdi,Santiago Juan G.,Goodson Kenneth E.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7510581/7517513/07517728.pdf?arnumber=7517728

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