Elucidating Defect Effects on Surface Diffusivity and Enhanced Electromigration Resistance Using Density Functional Theory-Reference-Cited by-同舟云学术

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Elucidating Defect Effects on Surface Diffusivity and Enhanced Electromigration Resistance Using Density Functional Theory

Published:2023-10-22 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE Nanotechnology Materials and Devices Conference (NMDC)
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Author:

Chen Hsin-Yi Tiffany¹,Chen Hsin-Yu²,Liao Chien-Neng³

Affiliation:

1. National Tsing Hua University,College of Semiconductor Research,Department of Engineering & System Science; Materials Science & Engineering,Hsinchu City,Taiwan,300044

2. National Tsing Hua University,Department of Materials Science & Engineering,Hsinchu City,Taiwan,300044

3. National Tsing Hua University,College of Semiconductor Research,Department of Materials Science & Engineering,Hsinchu City,Taiwan,300044

Funder

Ministry of Science and Technology

National Tsing Hua University

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10343386/10343419/10344145.pdf?arnumber=10344145

Reference11 articles.

1. Atomic mobility at solid surfaces

2. Electromigration reliability issues in dual-damascene Cu interconnections

3. Observation of Atomic Diffusion at Twin-Modified Grain Boundaries in Copper

4. Calculation of the electronic structure of stepped metal surfaces

5. Electronic structure calculation for a stepped Cu(110) surface by using a real space approach

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