Engineer the Channel and Adapt to it: Enabling Wireless Intra-Chip Communication-Reference-Cited by-同舟云学术

Engineer the Channel and Adapt to it: Enabling Wireless Intra-Chip Communication

Published:2020-05 Issue:5 Volume:68 Page:3247-3258
ISSN:0090-6778
Container-title:IEEE Transactions on Communications
language:
Short-container-title:IEEE Trans. Commun.

Author:

Timoneda Xavier¹^ORCID,Abadal Sergi¹^ORCID,Franques Antonio²^ORCID,Manessis Dionysios³^ORCID,Zhou Jin⁴^ORCID,Torrellas Josep²,Alarcon Eduard¹,Cabellos-Aparicio Albert¹^ORCID

Affiliation:

1. NaNoNetworking Center in Catalunya (N3Cat), Universitat Politècnica de Catalunya (UPC), Barcelona, Spain

2. Department of Computer Science, University of Illinois at Urbana–Champaign (UIUC), Champaign, IL, USA

3. System Integration & Interconnection Technologies, Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin, Germany

4. Department of Electrical and Computer Engineering, University of Illinois at Urbana–Champaign (UIUC), Champaign, IL, USA

Funder

Spanish MINECO

EU’s H2020 FET-OPEN program

Catalan Institution for Research and Advanced Studies

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/26/9094270/08999564.pdf?arnumber=8999564

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