Thermal Control of Quasi-2-Level Super-Switch by Power Routing
Author:
Affiliation:
1. Robert Bosch GmbH, Renningen, Germany
2. Huawei Technologies Nuremberg Research Center, Nuremberg, Germany
3. Chair of Power Electronics, Christian-Albrechts, University of Kiel, Kiel, Germany
Funder
Huawei Technologies Duesseldorf GmbH
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Control and Systems Engineering
Link
http://xplorestaging.ieee.org/ielx7/41/10184152/10057220.pdf?arnumber=10057220
Reference21 articles.
1. Prediction and Validation of Wear-Out Reliability Metrics for Power Semiconductor Devices With Mission Profiles in Motor Drive Application
2. An Industry-Based Survey of Reliability in Power Electronic Converters
3. Analytical Model of Power MOSFET Switching Losses due to Parasitic Components
4. A Guideline for Reliability Prediction in Power Electronic Converters
5. Pulse-Shadowing Based Thermal Balancing in Multichip Modules
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Emerging Trends and Challenges in Thermal Management of Power Electronic Converters: A State of the Art Review;IEEE Access;2024
2. Gate Voltage-Based Active Thermal Control of Power Semiconductor Devices;IEEE Transactions on Power Electronics;2023-09
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