Packaged In-Phase/Out-of-Phase Printed Multi-Layer Power Dividers
Author:
Affiliation:
1. Concordia University,Department of Electrical and Computer Engineering,Montreal,QC,Canada,H3G 2W1
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10237348/10237371/10237382.pdf?arnumber=10237382
Reference5 articles.
1. Self-Packaged, Low-Loss, Planar Bandpass Filters for Millimeter-Wave Application Based on Printed Gap Waveguide Technology
2. A novel design of printed ridge gap waveguide‐based 0‐dB backward‐wave coupler
3. Broadband Millimeter-Wave Beamforming Components Augmented With AMC Packaging
4. Numerical prepackaging with pmc lid-efficient and simple design procedure for microstrip circuits in-cluding the packaging;kishk;Applied Computational Electromagnetics Society Journal,2012
5. DESIGN OF A MINIATURIZED MULTILAYER TUNABLE SUPER WIDEBAND BPF
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