Design Considerations for 3D Heterogeneous Integration Driven Analog Processing-in-Pixel for Extreme-Edge Intelligence-Reference-Cited by-同舟云学术

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Design Considerations for 3D Heterogeneous Integration Driven Analog Processing-in-Pixel for Extreme-Edge Intelligence

Published:2023-12-05 Issue: Volume: Page:1-5
ISSN:
Container-title:2023 IEEE International Conference on Rebooting Computing (ICRC)
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Author:

Yin Zihan¹,Datta Gourav²,Kaiser Md Abdullah-Al²,Beerel Peter²,Jacob Ajey³,Jaiswal Akhilesh¹

Affiliation:

1. University of Wisconsin-Madison,Electrical & Computer Engineering,Madison,USA

2. University of Southern California,Ming Hsieh Department of Electrical and Computer Engineering,Los Angeles,USA

3. University of Southern California,Information Sciences Institute,Marina Del Rey,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10385233/10386130/10386206.pdf?arnumber=10386206

Reference25 articles.

1. Pseudo-Stereo for Monocular 3D Object Detection in Autonomous Driving

2. New Generation Deep Learning for Video Object Detection: A Survey

3. A 2.6 e-rms Low-Random-Noise, 116.2 mW Low-Power 2-Mp Global Shutter CMOS Image Sensor with Pixel-Level ADC and In-Pixel Memory

4. The Scaling of Cu-Cu Hybrid Bonding For High Density 3D Chip Stacking

5. 9.6 A 1/2.3inch 12.3Mpixel with On-Chip 4.97TOPS/W CNN Processor Back-Illuminated Stacked CMOS Image Sensor

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