Enabling Adaptable Mixed-Signal Circuits Using Advanced Packaging Techniques-Reference-Cited by-同舟云学术

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Enabling Adaptable Mixed-Signal Circuits Using Advanced Packaging Techniques

Published:2024-01-29 Issue: Volume: Page:1-6
ISSN:
Container-title:2024 International Conference on Optimization Computing and Wireless Communication (ICOCWC)
language:
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Author:

Upadhyay Ramakant¹,Upadhyay Ajay Kumar²,Mandal Sanjeev Kumar³

Affiliation:

1. Sanskriti University,Department of Computer Science Engineering,Mathura,Uttar Pradesh,India

2. College of Engineering, Teerthanker Mahaveer University,Moradabad,Uttar Pradesh,India

3. Jain (Deemed to be University),Department of Computer Science and Information Technology,Bangalore,India

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10470457/10470444/10470618.pdf?arnumber=10470618

Reference12 articles.

1. Breaking the energy-efficiency barriers for smart sensing applications with “Sensing with Computing” architectures

2. SRC-led materials research: 40 years ago, and now

3. Versatile On‐Chip Programming of Circuit Hardware for Wearable and Implantable Biomedical Microdevices

4. US Microelectronics Packaging Ecosystem: Challenges and Opportunities;Noor;arXiv preprint,2023

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