Author:
Hu Xinxin,Ma Shenglin,Gong Dan,Wang Mengcheng,Jin Yufeng,Wang Wei,Chen Jing,He Shuwei,Hu Liulin,Zhou Bin
Cited by
2 articles.
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1. Design and Test of Beidou RF Module Based on JT110;2022 7th International Conference on Intelligent Computing and Signal Processing (ICSP);2022-04-15
2. A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs);IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-05