Author:
Han Xu,Li Xiaoyan,Yao Peng,Chen Dalong
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Sn-58Bi/Cu porous joint formation under air condition without pressure;Fourth International Conference on Mechanical Engineering, Intelligent Manufacturing, and Automation Technology (MEMAT 2023);2024-04-01
2. Microstructures and mechanical properties of ENIG/Sn-3.5Ag/ENIG joints formed by ultrasonic-assisted solder bonding;Journal of Materials Research and Technology;2023-05