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SPICE Models of Shielded Single and Multiconductor Cables for EMC Analyses

  • Published:2020-08 Issue:4 Volume:62 Page:1563-1571
  • ISSN:0018-9375
  • Container-title:IEEE Transactions on Electromagnetic Compatibility
  • language:
  • Short-container-title:IEEE Trans. Electromagn. Compat.

Author:

Raya MoustafaORCID,Vick Ralf

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics

Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Comparison of Suppression Effect by CMF for UTP and STP Lines Using Chain Parameter Matrix;2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI);2023-07-29

2. A computationally efficient hybrid FDTD method for solving field-to-wire coupling problems in shielded cables with junctions inside electrically large objects;2022 International Symposium on Electromagnetic Compatibility – EMC Europe;2022-09-05

3. SPICE-Based Lumped Circuit Model of Multiconductor Lines Excited by an Incident Plane Wave;2022 International Symposium on Electromagnetic Compatibility – EMC Europe;2022-09-05

4. Analysis of CM-Signal Suppression Effect from DM Signal by Common-Mode Choke Coil Using Chain-Parameter Matrix;2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI);2022-08-01

5. Electromagnetic Compatibility Analysis of Quadcopter UAVs Using the Equivalent Circuit Approach;IEEE Open Journal of Antennas and Propagation;2022
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