Author:
Lee SungHoon,Kim ByoungJoo,Park JaeHyoung,Yoo SangKyu,Jeon JaeWook
Cited by
2 articles.
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1. Test Structure for Evaluation of Pad Size for Wafer Probing;2023 35th International Conference on Microelectronic Test Structure (ICMTS);2023-03-27
2. Procedure for Controlling Pad Scrub During High-Temperature Wafer Probing;2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS);2022-03-21