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TheSPoT: Thermal Stress-Aware Power and Temperature Management for Multiprocessor Systems-on-Chip

  • Published:2018-08 Issue:8 Volume:37 Page:1532-1545
  • ISSN:0278-0070
  • Container-title:IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
  • language:
  • Short-container-title:IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

Author:

Iranfar ArmanORCID,Kamal MehdiORCID,Afzali-Kusha AliORCID,Pedram Massoud,Atienza DavidORCID

Funder

EC H2020 MANGO FETHPC Project

ERC Consolidator Grant COMPUSAPIEN

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software

Cited by 25 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. TREAFET: Temperature-Aware Real-Time Task Scheduling for FinFET based Multicores;ACM Transactions on Embedded Computing Systems;2024-06-29

2. A Two-Level Thermal Cycling-Aware Task Mapping Technique for Reliability Management in Manycore Systems;IEEE Access;2024

3. Deep Learning-Driven Anomaly Detection for Green IoT Edge Networks;IEEE Transactions on Green Communications and Networking;2023

4. Reinforcement Learning-Based Joint Reliability and Performance Optimization for Hybrid-Cache Computing Servers;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2022-12

5. Minimizing the Maximum Processor Temperature by Temperature-Aware Scheduling of Real-Time Tasks;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2022-08
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