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TSV-Aware Analytical Placement for 3-D IC Designs Based on a Novel Weighted-Average Wirelength Model

  • Published:2013-04 Issue:4 Volume:32 Page:497-509
  • ISSN:0278-0070
  • Container-title:IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
  • language:
  • Short-container-title:IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

Author:

Hsu Meng-Kai,Balabanov Valeriy,Chang Yao-Wen

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software

Cited by 49 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Pplace-MS: Methodologically Faster Poisson’s Equation-Based Mixed-Size Global Placement;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2024-02

2. HyPlace-3D: A Hybrid Placement Approach for 3D ICs Using Space Transformation Technique;2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD);2023-10-28

3. Effective Analytical Placement for Advanced Face-to-Face-Bonded Circuit Designs;2023 IEEE 15th International Conference on ASIC (ASICON);2023-10-24

4. DREAMPlace 4.0: Timing-Driven Placement With Momentum-Based Net Weighting and Lagrangian-Based Refinement;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2023-10

5. Analytical Placement with 3D Poisson’s Equation and ADMM-based Optimization for Large-scale 2.5D Heterogeneous FPGAs;ACM Transactions on Design Automation of Electronic Systems;2023-09-08
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