System-Level Modeling and Analysis of Thermal Effects in WDM-Based Optical Networks-on-Chip-Reference-Cited by-同舟云学术

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System-Level Modeling and Analysis of Thermal Effects in WDM-Based Optical Networks-on-Chip

Published:2014-11 Issue:11 Volume:33 Page:1718-1731
ISSN:0278-0070
Container-title:IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
language:
Short-container-title:IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

Author:

Ye Yaoyao,Wang Zhehui,Yang Peng,Xu Jiang,Wu Xiaowen,Wang Xuan,Nikdast Mahdi,Wang Zhe,Duong Luan H. K.

Funder

GRF

DAG

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software

Link

http://xplorestaging.ieee.org/ielx7/43/6926885/06930846.pdf?arnumber=6930846

Cited by 33 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Photonic-crystal-based hybrid wavelength-mode division multiplexer for SOI platforms;Applied Optics;2024-07-17

3. OpSAVE: Eviction Based Scheme for Efficient Optical Network-on-Chip;Microprocessors and Microsystems;2024-07

4. Automated Optical Accelerator Search: Expediting Green and Ubiquitous DNN-Powered Intelligence;IEEE Design & Test;2023-12

5. Dynamic Thermal Management of 3D Memory through Rotating Low Power States and Partial Channel Closure;ACM Transactions on Embedded Computing Systems;2023-11-09

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