Funder
National Science Foundation
Samsung
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software
Cited by
6 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Bayesian Tensor CPD: Modeling and Inference;Bayesian Tensor Decomposition for Signal Processing and Machine Learning;2023
2. Towards Flexible Sparsity-Aware Modeling: Automatic Tensor Rank Learning Using the Generalized Hyperbolic Prior;IEEE Transactions on Signal Processing;2022
3. High-Dimensional Uncertainty Quantification via Tensor Regression With Rank Determination and Adaptive Sampling;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-09
4. Sparse Tucker Tensor Decomposition on a Hybrid FPGA–CPU Platform;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2021-09
5. Rank-Revealing Block-Term Decomposition for Tensor Completion;ICASSP 2021 - 2021 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP);2021-06-06