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STREAM: Stress and Thermal Aware Reliability Management for 3-D ICs

  • Published:2019-11 Issue:11 Volume:38 Page:2058-2071
  • ISSN:0278-0070
  • Container-title:IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
  • language:
  • Short-container-title:IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

Author:

Wang HaiORCID,Huang Darong,Liu Rui,Zhang Chi,Tang HeORCID,Yuan Yuan

Funder

National Natural Science Foundation of China

Northwestern Polytechnical University

Scientific Research Foundation for the Returned Overseas Chinese Scholars, State Education Ministry

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Research on thermal management of 3D-ICs assisted by deep learning;Microelectronics Reliability;2024-08

2. A Compact Three-dimensional Wilkinson Power Divider Based on TSV;2023 6th International Conference on Electronics Technology (ICET);2023-05-12

3. 3D-DNaPE: Dynamic Neighbor-Aware Performance Enhancement for Thermally Constrained 3D Many-Core Systems;IEEE Access;2023

4. Reinforcement Learning-Based Joint Reliability and Performance Optimization for Hybrid-Cache Computing Servers;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2022-12

5. A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs);IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-05
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