Author:
Gong Zheng,Rashidzadeh Rashid
Funder
Natural Sciences and Engineering Research Council of Canada
CMC Microsystems
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software
Cited by
26 articles.
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1. Voltage Skew-Based Test Technique for Pre-Bond TSVs in 3-D ICs;IEEE Transactions on Circuits and Systems II: Express Briefs;2024-08
2. Electrothermal Transient Co-Simulation With Domain Decomposition Method for 3-D Complex Integrated Systems;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-08
3. 2D/2.5D/3D Heterogeneous Integration;Electronic Device Failure Analysis Technology Roadmap;2023-11-01
4. 2D/2.5D/3D Heterogeneous Integration;Electronic Device Failure Analysis Technology Roadmap;2023-11-01
5. A Single-TSV and Single-DCDL Approach for Skew Compensation of Multi-Dies Clock Synchronization in 3-D-ICs;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2023-04