A new low loss lead free LTCC system for wireless and RF applications-Reference-Cited by-同舟云学术

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A new low loss lead free LTCC system for wireless and RF applications

Published: Issue: Volume: Page:
ISSN:
Container-title:Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154)
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Author:

Donahue P.C.,Taylor B.E.,Amey D.I.,Draudt R.R.,Smith M.A.,Horowitz S.J.,Larry J.R.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx4/5497/14778/00670779.pdf?arnumber=670779

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Determination of boron and lithium in ferroelectric samples by ICP-OES and ICP-MS;Microchimica Acta;2008-07-16

2. Optimization of MgTiO3–CaTiO3 based LTCC tapes containing B2O3 for use in microwave applications;Ceramics International;2005-01

3. Effect of processing route on thermomechanical properties of low temperature firing ceramic for electronic packaging;British Ceramic Transactions;2002-02

4. Compositions of MgTiO3–CaTiO3 ceramic with two borosilicate glasses for LTCC technology;Journal of the European Ceramic Society;2000-12

5. Surface polishing of three dimensional micro structures;17th IEEE International Conference on Micro Electro Mechanical Systems. Maastricht MEMS 2004 Technical Digest

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